| abstract |
A desorption method is provided that is compatible with metal deposition that does not require excessive temperatures. A method of depositing a metal film on a substrate includes a supercritical preclean step, a supercritical desorption step, and a metal deposition step. Preferably, the preclean step includes maintaining supercritical carbon dioxide and a chelating agent in contact with the substrate to remove the oxide layer from the metal surface of the substrate. An apparatus for depositing a metal film on a substrate includes a transfer module, a supercritical processing module, a vacuum module, and a metal deposition module. [Selection] Figure 1 |