abstract |
Provided is an epoxy resin composition for sealing that is particularly excellent in stress reduction, reflow resistance, and thermal shock resistance without impairing properties such as fluidity, flame retardancy, and curability. A sealing epoxy containing a silicon-containing polymer having (A) an epoxy resin, (B) a curing agent, and (C) a specific structural site (1) and having a number average molecular weight of 8000 to 12000. Resin composition. [Selection figure] None |