| abstract |
An epoxy resin composition that provides a cured product excellent in fluidity, adhesiveness, and elastic modulus reduction effect, and an electronic component device including an element sealed thereby. An epoxy resin composition comprising (A) an epoxy resin, (B) a curing agent, and (C) a silicone compound, wherein (C) the silicone compound is a compound represented by a specific chemical formula Composition. [Selection] Figure 1 |