| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7f9af914ed2fb00cd4f1b8b1a28964e4 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07F5-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-318
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K5-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L85-04 |
| filingDate |
2007-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5b5ec094d8eb7fddc476761c36e9282b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5e9d18dba5b5abb5c5372973e4a7b863
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7e6770dcfd6ba12af41b3b238b047b71 |
| publicationDate |
2009-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2009102234-A |
| titleOfInvention |
Compound for forming heat dissipation material |
| abstract |
Disclosed is a heat-dissipating material-forming compound that can form a heat-dissipating material having high heat conductivity and excellent moldability and adhesion without adding a heat-conducting filler. A compound for forming a heat dissipation material containing a borazine ring, wherein one or more of boron atoms and nitrogen atoms of a borazine skeleton constituting the borazine ring have a substituent other than a hydrogen atom. It is. [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014220468-A |
| priorityDate |
2007-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |