http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009094442-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bc905cbef116a1ec61d12125af9427f3 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-07378 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49222 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-07314 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R3-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-073 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-00 |
| filingDate | 2007-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_23f1a579beac6fbcba744dfa1265d469 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f1f8d5fe7b94d0ce2bf67e62a00e9e31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fdc9151b1fcb282230510d0a251622d9 |
| publicationDate | 2009-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2009094442-A |
| titleOfInvention | Manufacturing method and structure of conductive film, and probe card provided with the conductive film |
| abstract | A method of manufacturing a conductive film and a structure thereof, and a probe card including the conductive film. The conductive film covers a metal micro-wire array unit composed of a plurality of metal micro-wires in a single-layer unidirectional arrangement with an insulating thin film by LIGA technology and polymer thick film technology, and the insulating thin film has a high dielectric constant. And a metal thin film made of Ni-Co alloy having high conductivity and high strength. By applying surface treatment and mechanical healing technology in a vacuum environment, the metal micro-ray array unit is adhered and deposited to a predetermined thickness to form a conductive film, and this conductive film is necessary with an energy beam such as laser, ion beam or plasma. Cut to size. The conductive film is bonded to a wire expansion plate, thereby providing a probe card that can be applied to a wafer having an arbitrary bonding pad arrangement, has a low manufacturing cost, is easily repaired, and can perform a large area probe test. [Selection] Figure 14 |
| priorityDate | 2007-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 33.