| abstract |
An object of the present invention is to provide a curable resin composition capable of forming a cured product having excellent hardness, solvent resistance, heat resistance, and adhesion to a substrate, and to provide hardness, solvent resistance, heat resistance, To provide a cured product having excellent adhesion to a substrate. A curable resin composition includes a polymer A containing at least an epoxy group-containing vinyl monomer a1 as a monomer component, and at least an alkoxysilyl group-containing vinyl represented by the following formula (I). And a polymer B containing a monomer as a monomer component. [Selection figure] None |