abstract |
Provided is a method of forming a wiring pattern in which a desired slope portion is formed by preventing spreading of a resin material in a slope portion, and surfaces having different steps and having different heights can be satisfactorily connected to each other. . A wiring pattern forming method for connecting a first surface and a second surface arranged via a step, wherein a slope portion having a slope connecting the first surface and the second surface is formed. And a step of disposing a functional liquid containing a wiring pattern forming material on the first surface, the slope, and the second surface by using a droplet discharge method to form a wiring pattern that extends over the first surface, the slope, and the second surface. A step of forming the slope portion includes a step of forming a liquid repellent pattern by disposing a liquid material containing a liquid repellent material at a position surrounding the periphery of the slope portion using a droplet discharge method, And a step of disposing a slope portion forming material in a region surrounded by the pattern. [Selection] Figure 6 |