| abstract |
A dry film formed from a photosensitive polyimide resin composition containing a novel polyimide resin in which a reactive group capable of reacting with a crosslinking agent to form a crosslinking point is previously introduced before imidization. A relatively low elastic modulus and heat resistance can be imparted to the photosensitive cover film. A novel polyimide resin includes a diamine component containing an amide group-containing siloxane diamine compound represented by the formula (1), 3,3 ′, 4,4′-diphenylsulfonetetracarboxylic dianhydride, and the like. An acid dianhydride component containing an aromatic acid dianhydride is imidized. [Chemical 1] In Formula (1), R 1 and R 2 are each an alkylene group that may be independently substituted, m is an integer of 1 to 30, and n is an integer of 0 to 20. [Selection figure] None |