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filingDate 2008-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5a6685fdd85bf1149ce1bebdd5c7b61d
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publicationDate 2009-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2009065192-A
titleOfInvention Manufacturing method of silicon film and silicon nitride film
abstract A heating element CVD in which a source gas introduced into a processing container (vacuum chamber) is decomposed and / or activated by a heating element to deposit a thin film on a substrate disposed in the processing container (vacuum chamber). In the apparatus, there is provided a heating element CVD method in which the life of the heating element is extended and the fixing method of the heating element is improved, and the productivity is improved. A connecting portion 33 in which a heating element 3 is connected to a power supply mechanism and / or a supporting portion in which the heating element 3 is supported by a support 31 is provided with a gap between the connecting portion 33 and the supporting portion. A heating element CVD apparatus provided with a gas introduction mechanism 321 that can be present and covered with a cover without coming into contact with the heating element 3 and can introduce gas into a gap between the cover, the connection portion 33 and the support portion is used. The purge gas is introduced into the end of the heating element 3 inserted into the heating element insertion port provided in the connection portion 33. [Selection] Figure 1
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