http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009065013-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_cdd94f212dc7aef02fc1dcf28fa9b4fd |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D1-26 |
| filingDate | 2007-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_048714ac560a466f5b6365668a92c145 |
| publicationDate | 2009-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2009065013-A |
| titleOfInvention | Wiring pattern forming method and wiring board formed thereby |
| abstract | Provided is a forming method capable of forming a highly reliable wiring (circuit) pattern by preventing plating deposition on an unintended portion in pattern formation of wiring using a droplet discharge method and electroless plating. To do. Furthermore, a wiring board manufactured using the formation method is provided. A method for forming a wiring pattern by a droplet discharge method, wherein an ink pattern containing a composition that exhibits a function as a catalyst for electroless plating is disposed on a substrate by a droplet discharge method. Forming a plating deposition inhibiting composition on a portion of the substrate where the ink is not disposed, and performing electroless plating on the substrate on which the ink pattern and the plating deposition inhibiting composition are disposed. And a step of depositing a plating metal on the ink pattern by performing the wiring pattern forming method. [Selection figure] None |
| priorityDate | 2007-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 98.