| abstract |
The present invention provides a multilayer substrate in which a polyimide film is less peeled in a polyimide substrate laminated glass substrate multilayer substrate. A multi-layer substrate having a structure in which a heat-resistant film is laminated on a glass substrate, the heat-resistant film reacting an aromatic diamine having a benzoxazole structure with an aromatic tetracarboxylic acid anhydride. A multilayer substrate, which is a polyimide film obtained and having a linear expansion coefficient of −2 ppm / ° C. to 10 ppm / ° C. [Selection figure] None |