http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009057590-A

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_73ebc284a55d5daf0e209d6186c9e65c
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02F1-1337
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05H1-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-00
filingDate 2007-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2fa2608c1f5757c8e04936d45a8c6a1e
publicationDate 2009-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2009057590-A
titleOfInvention Plasma processing apparatus, sputtering apparatus, and liquid crystal device manufacturing apparatus
abstract Disclosed are a plasma processing apparatus, a sputtering apparatus, and a liquid crystal device manufacturing apparatus that prevent occurrence of abnormal discharge during plasma processing. The plasma processing apparatus 3 generates plasma by applying high-frequency power between electrodes 9a and 9b arranged opposite to each other in a chamber 3a. An adhesion preventing plate 30 for preventing the processing product from adhering to the inner wall surface of the chamber 3 a is provided, and at least a positive voltage is applied to the adhesion preventing plate 30. [Selection] Figure 1
priorityDate 2007-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 18.