http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009057410-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_24aca9ded2638ea793d05360dde7a4a0 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2333-10 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J7-065 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J3-00 |
| filingDate | 2007-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_da83fd99ea5613511ccab24fc65e8fa2 |
| publicationDate | 2009-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2009057410-A |
| titleOfInvention | Method for producing methacrylic resin molding material |
| abstract | The present invention provides a method capable of producing a methacrylic resin molding material having high repose angle uniformity. A methacrylic resin molding material is produced by attaching an amide compound to the surface of a methacrylic resin pellet at 35 ° C. or higher. The amount of the amide compound used is preferably 0.003 to 0.05 parts by weight with respect to 100 parts by weight of the methacrylic resin pellets. The amide compound is preferably a bisamide compound and has a melting point of 30 to 200 ° C. [Selection figure] None |
| priorityDate | 2007-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 66.