http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009054949-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205
filingDate 2007-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f2b7e810d73fce40f2a9fe9f5a40fb7e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_89bb62e7c6a964fa2572ec58013c74d7
publicationDate 2009-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2009054949-A
titleOfInvention Metal wiring formation method
abstract PROBLEM TO BE SOLVED: To provide a technique for quickly drawing a practical circuit in a drawing wiring method using an ink jet apparatus. The present invention forms a lyophilic and lyophobic region with respect to ink containing metal fine particles in a drawing region of a substrate and suppresses bulges generated when the ink is dried, thereby preventing the substrate or the ink jet. Provided is a method of forming wiring by driving a head once to perform drawing wiring and sintering. [Selection] Figure 1
priorityDate 2007-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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