| abstract |
A semiconductor device having excellent connection reliability between a semiconductor device and a mounting substrate is provided. A semiconductor device 100 having an external connection terminal 110, wherein the external connection terminal 110 includes a Cu electrode 106, an intermetallic compound 118 containing Cu formed on the Cu electrode 106, and an intermetallic compound 118. Stopper portions 132 and 136 covering the surface with a space therebetween, and a solder alloy made of impurities including Bi and Sn formed on the stopper portions 132 and 136 and the intermetallic compound 118. [Selection] Figure 3 |