| abstract |
An anisotropic conductive film capable of obtaining high connection reliability and a method of manufacturing a connection structure using the same are provided. An anisotropic conductive material having a minimum melt viscosity of 300 to 1000 Pa ยท s, in which conductive particles are dispersed in an insulating adhesive resin containing polybutadiene particles, a cationic polymerizable resin, and a cationic curing agent. The film 2 is disposed on the terminal electrode of the glass substrate 1, the terminal electrode of the flexible printed circuit board 3 is disposed on the anisotropic conductive film 2, and the terminal electrode is pressed from the flexible printed circuit board side using a heating tool. Connect them electrically. [Selection] Figure 1 |