Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-312 |
filingDate |
2008-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1512e632b2dd75442d3e4f65473c85eb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dd1403007a59f614e7df008013d026d9 |
publicationDate |
2009-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2009049417-A |
titleOfInvention |
Semiconductor device manufacturing method and semiconductor device |
abstract |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device capable of reducing defects such as a decrease in uniformity of a coating film due to coating and entrainment of bubbles when a photosensitive resin composition is applied to a silicon-based substrate. . SOLUTION: 100 parts by weight of an alkali-soluble resin (A) and photosensitive materials (B) 1 to 10 The semiconductor substrate is pretreated with a solvent (D) immediately before the photosensitive resin composition containing 0 part by weight is applied onto the silicon substrate (C). Device manufacturing method. [Selection figure] None |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014220301-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104797982-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/RU-2609105-C1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014178333-A1 |
priorityDate |
2002-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |