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publicationDate 2009-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2009049417-A
titleOfInvention Semiconductor device manufacturing method and semiconductor device
abstract PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device capable of reducing defects such as a decrease in uniformity of a coating film due to coating and entrainment of bubbles when a photosensitive resin composition is applied to a silicon-based substrate. . SOLUTION: 100 parts by weight of an alkali-soluble resin (A) and photosensitive materials (B) 1 to 10 The semiconductor substrate is pretreated with a solvent (D) immediately before the photosensitive resin composition containing 0 part by weight is applied onto the silicon substrate (C). Device manufacturing method. [Selection figure] None
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