abstract |
An object of the present invention is to provide a bonding device in which a portion of a bonding wire in the vicinity of the terminal passes through an adhesive layer, and the bonding wire is softened by thermocompression bonding and does not protrude as the adhesive. An object of the present invention is to provide an adhesive film with improved embedding in the vicinity. An adhesive film of the present invention is an adhesive film used for a semiconductor device in which a portion near a terminal of a bonding wire passes through an adhesive layer, and the adhesive film is an acrylic resin, An epoxy resin, a curing agent and a curing accelerator are contained. [Selection] Figure 1 |