| abstract |
SOLUTION: (A) an alkali-soluble resin having a phenolic hydroxyl group, (B) a phenolic low-molecular compound, (C) a compound having a quinonediazide group, (D) a softening point of 50 to 80 ° C. and an epoxy equivalent A positive photosensitive insulating resin composition comprising an epoxy resin having a molecular weight of 211 to 285 g / eq, (E) crosslinked polymer particles, and (F) an adhesion assistant, and curing the composition Hardened product. [Effects] When the positive photosensitive insulating resin composition according to the present invention is used, it is possible to form a cured product which is excellent in resolution, insulation, thermal shock, adhesion and the like and has little deformation after post-baking. it can. Therefore, it is possible to provide a cured product such as an interlayer insulating film and a planarizing film for a circuit board excellent in these various characteristics, and a circuit board provided with such a cured product. [Selection figure] None |