| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_61d93a6e726c19d7744f15521b902cd6 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-124
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-262 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-282
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07D235-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C22-52 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C22-52 |
| filingDate |
2008-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_459a00a461b8a6fea6f3916970005941
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7b49432335732ed16c81b707dce4e758
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1100bb1724525a709d768bfe9c4ad060 |
| publicationDate |
2009-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2009046761-A |
| titleOfInvention |
Surface treatment agent |
| abstract |
The present invention provides a surface treatment agent that can be used for soldering using not only conventional eutectic solder but also lead-free solder and forming a film having excellent heat resistance. A surface treatment agent for treating the surface of a substrate made of copper or an alloy thereof, comprising a solution of an imidazole compound and a sugar alcohol and containing zinc ions. [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106460188-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017203194-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10184186-B2 |
| priorityDate |
2007-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |