http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009042008-A

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filingDate 2007-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5bedab42e498855e96ca89ae4a2e5f1f
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publicationDate 2009-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2009042008-A
titleOfInvention Probe card, semiconductor inspection apparatus, and semiconductor device manufacturing method
abstract An inspection apparatus is provided which has a low load, a stable contact characteristic, and a good position accuracy of a contact terminal tip for conducting an electrical signal inspection of a semiconductor element having electrodes arranged at a narrow pitch. A multi-layered wiring board is provided with a frame bonded and fixed to the back surface of a probe sheet so as to surround a group of pyramidal or truncated pyramidal contact terminals formed in a central region on the probing side of the probe sheet. A plurality of guide pins 7 having a spring property apply a pressing force to the frame 5 and the pushing piece 8 at the center, and allow a slight tilt. [Selection] Figure 2
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7307104-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102542800-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190095395-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11402408-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200074244-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2021182083-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9927487-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20180104733-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102236035-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210120854-A
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Total number of triples: 31.