Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d72711e97d894c55af805c9de2053ab |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-241 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-627 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-34 |
filingDate |
2007-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_88a1f822021fdb4b26c068babe486008 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d4273282efd3b3f20dc0530b53f48501 |
publicationDate |
2009-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2009041097-A |
titleOfInvention |
Copper plating method |
abstract |
Provided is a copper plating method for depositing a copper plating film that is uniform and smooth and has a good specular gloss even when a relatively thin copper plating film is formed. In a copper plating method, an object to be plated is activated with a pre-dip acidic solution and is further brought into contact with a pretreatment liquid containing at least 0.75 mg / L bromide ions, or the object to be plated is contacted. A copper plating method in which copper is deposited by electroplating after contacting with a pre-dip acidic solution containing at least 0.75 mg / L bromide ions. [Selection figure] None |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013044007-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011210919-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009041096-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011179085-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014177705-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015078443-A |
priorityDate |
2007-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |