| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_24aca9ded2638ea793d05360dde7a4a0 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K50-844
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-186
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K50-844
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K85-621
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-688
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-0203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4215 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L51-52 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-134
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-17
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-0203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-49 |
| filingDate |
2008-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_72fac3404fa6401850068afac75814b1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_422be13a636652da59dfaf19dc16ecfb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ec12b247560b0672bbaa38f0ff61cf8d |
| publicationDate |
2009-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2009041028-A |
| titleOfInvention |
Resin composition for optical semiconductor encapsulation |
| abstract |
[PROBLEMS] To be excellent in light transmittance immediately after curing and excellent in light transmittance even when irradiated with blue light / ultraviolet light for a long time or used at a high temperature for a long time, that is, initial light transmittance, ultraviolet light resistance and heat resistance. The resin composition for optical semiconductor sealing which provides the hardened | cured material which is excellent in all of property is provided. A resin composition for sealing an optical semiconductor to which heat resistance and ultraviolet light resistance are imparted, comprising the following components (A) and (B) and a quaternary phosphonium salt. Composition. (A): (meth) acrylic polymer containing epoxy group (B): at least one curing agent selected from the group consisting of (b1) to (b4) below (b1) polyvalent carboxylic acid (b2) (B3) Reaction product of polyvalent carboxylic acid and vinyl ether compound (b4) Reaction product of polycarboxylic acid anhydride and divinyl ether compound [Selection] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015007165-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6039080-B2 |
| priorityDate |
2001-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |