Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6f0f795b474ba632e49277e4cbe793b5 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C2043-3438 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C33-0022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29L2011-0016 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-566 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-568 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C43-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C33-68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C43-021 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29L11-00 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C43-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C33-34 |
filingDate |
2007-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_38cc201fee8d380abb2f42ad0c5a6035 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_82ae28ce390cec5706f37d8e2e0b93ec http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3a09e0b18cbc8b08ec092c5317f680a6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3754d96ad393b116cc6fdb7dd0268950 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_18f519aa825f36d906b780f0405cb88b |
publicationDate |
2009-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2009039985-A |
titleOfInvention |
Optical element resin sealing molding method and apparatus |
abstract |
In a case where a plurality of required LED chips (optical elements) 2 mounted on a substrate 1 are collectively encapsulated with resin (compression molding), it can be easily and immediately adapted to small-scale production and mass production. A high quality and high reliability product (LED molded product 3) is efficiently obtained. A mold unit A for sealing and molding (compression molding) an LED chip 2 with a liquid resin 5, and a pre-molding material supply unit B for supplying the LED chip 2 and the liquid resin 5 to the mold unit A An optical element resin sealing molding apparatus (optical element compression molding apparatus) comprising a molded product housing unit C for housing an LED molded product 3 molded by resin sealing with a mold unit A, before molding Between the material supply unit B and the molded product accommodation unit C, another mold unit A is detachably mounted on the mold unit A, and the number of the mold units A is arbitrarily adjusted. [Selection] Figure 1 |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20130104824-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015211121-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101867304-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102010680-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170099957-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015193096-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012101517-A |
priorityDate |
2007-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |