http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009021562-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J179-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 |
| filingDate | 2008-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_16138324678076211cac4fa7b3ae523b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_337e08f9822f207c077d8ab9e980c003 |
| publicationDate | 2009-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2009021562-A |
| titleOfInvention | Adhesive sheet for semiconductor, semiconductor device using the same, and method for manufacturing semiconductor device |
| abstract | To provide an adhesive sheet for a semiconductor capable of reducing defects such as cracks, chips and peeling during dicing even when the cutting speed is high, and reducing contamination by cutting powder. An adhesive sheet for a semiconductor having at least two adhesive layers of an α layer and a β layer having different compositions, wherein the α layer contains (a) an organic solvent-soluble polyimide and (b) an epoxy compound, (A) Content of organic solvent soluble polyimide is 15-90 weight part with respect to 100 weight part of (b) epoxy compound, (b) epoxy compound is (b-1) 25 degreeC and 1.013 * 10 < 5 > N. Containing an epoxy compound which is liquid at / m 2 and (b-2) an epoxy compound which is solid at 25 ° C. and 1.013 × 10 5 N / m 2 and (b-1) containing an epoxy compound which is liquid The amount is 20% by weight or more and less than 60% by weight with respect to the total epoxy compound, and the β layer contains an epoxy compound that is liquid at (b-1) 25 ° C. and 1.013 × 10 5 N / m 2 . , (B-1 Semiconductor adhesive sheet content is 70 wt% or less 40% by weight or more β layer of the epoxy compound is a liquid. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011049011-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5887693-B2 |
| priorityDate | 2007-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 243.