| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-5399
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate |
2007-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7cb5fbe8fa053352fab637de969950f8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ed0ee79f761dc2baa5a5bb5e5ce3aec2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b3a3c8b972120fefdae22445236dff1f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cbf9b941f5e810d1f8f9d8727ce8e213
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8276fc1bb9b9cb6580130b2e381edbaa |
| publicationDate |
2009-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2009019115-A |
| titleOfInvention |
Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
| abstract |
An epoxy resin composition for semiconductor encapsulation, for example, for ball grid arrays or transfer underfills, which has excellent moisture resistance reliability and flame retardancy as well as suppression of warpage, and does not cause problems such as environmental pollution. I will provide a. An epoxy resin composition for semiconductor encapsulation containing the following components (A) to (D). (A) Epoxy resin. (B) A phenol resin represented by the following general formula (1). (C) Inorganic filler. (D) Phosphononitrile acid phenyl ester compound. [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023120740-A1 |
| priorityDate |
2007-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |