| abstract |
[PROBLEMS] To prevent the occurrence of short-circuits by suppressing the flow of conductive particles when connecting an electronic component to a substrate or the like, and to obtain excellent conduction reliability by ensuring a high particle capture rate. The anisotropic conductive film having a two-layer structure that can be used easily and its efficient manufacturing method, and using the anisotropic conductive film, it has a high particle trapping rate and excellent conduction reliability. Provision of joints between electronic components and substrates. An anisotropic conductive film of the present invention includes an insulating layer 20 formed of an insulating resin composition 22, a light and thermosetting resin composition 12, and conductive particles 14, and includes conductive particles. 14 and a conductive particle-containing layer 10 formed by arranging a single layer at the interface on the insulating layer 20 side, and conductive from the side where the conductive particles 14 are present in the thickness direction of the conductive particle-containing layer 10. The degree of curing gradually decreases toward the side where the conductive particles 14 do not exist. [Selection] Figure 1 |