| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-5448
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate |
2007-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_337e08f9822f207c077d8ab9e980c003
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_16138324678076211cac4fa7b3ae523b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_379974967e7e926d5cb54f699c4d8cf8 |
| publicationDate |
2009-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2009010057-A |
| titleOfInvention |
Electronic device mounting method |
| abstract |
Provided is a method for mounting an electronic element with high electrical connection reliability using an adhesive composition for electronic devices, which has good recognition of alignment marks during dicing and flip-chip mounting. An electronic device mounting method for contacting and connecting a bump formed on an electronic device and an electrode pad formed on a mounting circuit board, wherein at least (A) a light transmittance of 70% on a bump forming surface. A step of dicing an electronic device substrate having a plurality of electronic elements on which an adhesive layer for electronic devices of 100% or less is formed, and (B) an electronic element on which the adhesive layer for electronic devices is formed at a predetermined temperature A method for mounting an electronic element, comprising: a temporary pressure bonding step in which a bump is bonded to an electrode pad on a mounting circuit board to electrically connect the bump and the electrode pad; and (C) a main pressure bonding step in which the adhesive layer for an electronic device is cured. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012015236-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102842541-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102842512-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010287835-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015002071-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012129474-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012109481-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9202804-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013030766-A |
| priorityDate |
2007-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |