| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2dcebf5a7f7ddc3b081f70e8ce1c4097 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-136295 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-136286
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-136227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-458 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02F1-1343
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-786
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-423
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-49 |
| filingDate |
2007-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bd9ef4c8d0718239f4755f1b035dfa77
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bb3a07b486dac4c302eda7b0483c1cd2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_307c87efa20a42b7e5927c5f7a563905
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_722aba04721a83427f6b583e7f6a259d |
| publicationDate |
2009-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2009008770-A |
| titleOfInvention |
Laminated structure and manufacturing method thereof |
| abstract |
A laminated structure in which an Al alloy is directly connected without increasing the contact electric resistance between an oxide transparent conductive film and an Al alloy film, wiring resistance is small, and galvanic corrosion is unlikely to occur in an electrolyte solution such as a developer. A manufacturing method thereof is provided. A method of manufacturing a laminated structure in which an oxide transparent conductive film and an Al alloy film are directly connected, the first step of forming the oxide transparent conductive film on a substrate, and the oxidation A second step of forming an Al alloy film containing an alloy component having a smaller ionization tendency than aluminum on the material transparent conductive film; and the Al alloy film is made to have a temperature higher than a precipitation temperature of an intermetallic compound composed of aluminum and the alloy component. And a third step of heating. [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010101160-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011021438-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015165563-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019212892-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011059401-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011033834-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011049544-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011013682-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010181668-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011091352-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8558382-B2 |
| priorityDate |
2007-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |