http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009001765-A

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filingDate 2007-09-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2009-01-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2009001765-A
titleOfInvention Adhesive composition, circuit connection structure, and semiconductor device
abstract It is possible to obtain excellent adhesive strength even under low temperature and short time curing conditions, and to maintain excellent performance even after a reliability test (for example, left at 85 ° C. and 85% RH). The present invention also provides an adhesive composition having excellent storage stability. An adhesive composition containing (a) a thermoplastic resin having a urethane bond and an ester bond in the same molecule, (b) a radical polymerizable compound, and (c) a radical polymerization initiator. The adhesive composition is characterized in that it contains two or more types of the above-mentioned (a) thermoplastic resins, and the glass transition temperature of at least one of the above-mentioned (a) thermoplastic resins is 40 ° C. or lower. [Selection figure] None
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190133021-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016526586-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20150111278-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016124933-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10400140-B2
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012067281-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015185399-A
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