| Predicate |
Object |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23H5-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32125
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25F3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate |
2006-06-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2008-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2008544523-A |
| titleOfInvention |
Controlled electrochemical polishing method |
| abstract |
The present invention is a method of polishing a substrate comprising at least one metal layer, wherein the substrate is electrochemically contacted between the substrate and at least one electrode in contact with a polishing composition comprising a reducing agent or oxidizing agent. The method of polishing by applying a specific potential. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009202262-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101419156-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2011081109-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5516604-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016510357-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8853082-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019508880-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011081109-A1 |
| priorityDate |
2005-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |