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filingDate 2005-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2008-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2008537215-A
titleOfInvention A method of manufacturing a modern smart card with integrated electronics using an isotropic thermoset adhesive material having a high quality outer surface.
abstract A state-of-the-art smart card that can accommodate a battery, LED, LCD, polymer dome switch, fingerprint sensor, and other electronic components not found in conventional smart cards. “Modern smart cards” and similar form factors (eg, documents, tags) having a high quality outer surface of polyvinyl chloride (PVC), polycarbonate (PC), synthetic paper, or other suitable material are: Through the use of injection-molded thermoset or thermoplastic materials that will become the core layer of “latest smart cards”, highly precise electronic components (eg “integrated circuit” chips, batteries, microprocessors, “light emitting diodes”) , “Liquid crystal display”, polymer dome switch, and antenna) can be integrated and manufactured in the bottom layer of the card structure. The lamination completion process can provide a high quality underside and the encapsulation of electronic components within a thermoset or thermoplastic material can provide protection from the heat and pressure of the lamination. [Selection] Figure 1
priorityDate 2005-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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