| abstract |
The present invention provides: (a) at least one polybenzoxazole precursor polymer; (b) at least one structure VI, wherein V is CH or N; Y is O or NR 3 , wherein R 3 is H, CH 3 or C 2 H 5 ; R 1 and R 2 are each independently H, C 1 -C 4 alkyl group, C 1 -C 4 alkoxy group, cyclopentyl or cyclohexyl. Or R 1 and R 2 can be condensed to form a substituted or unsubstituted benzene ring; and (c) at least one solvent; and a photosensitive resin composition comprising: Where the amount of the compound of structure VI present in the composition is the amount of residue when the composition is applied to a substrate and the subsequently applied substrate is processed to form an image on the substrate. An amount effective to inhibit formation, And if the polybenzoxazole precursor polymer consists solely of a polybenzoxazole precursor polymer that does not contain a photoactive moiety in the polymer, then (d) at least one photoactive compound can also be used in the composition Present in the composition. The present invention also relates to a method for forming a relief pattern and an electronic component using the above composition. [Chemical 1] |