abstract |
The present invention relates to a method of patterning a surface and the manufacture of vias with controlled deposition growth, and a patterned substrate prepared by such a method according to the invention. The method according to the present invention provides a substrate having at least one surface on which a material needs to be patterned, said surface having at least first and second surface regions having different surface properties A protective precipitation growth is further disposed in the first region, and at least one material is disposed in at least the second surface region, wherein the disposed material Is not substantially installed in the first surface area, or when installed in the first surface area, the installed material is selectively removed from the first surface area. And having. |