http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008528769-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48257 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31511 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2006-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2008-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2008528769-A |
| titleOfInvention | Molding composition, molding method and molded article |
| abstract | Provided is a sealing composition having high fluidity even if it contains a large amount of a filler. SOLUTION: (A) an epoxy resin, (B) an effective amount of a curing catalyst, (B1) a first latent cationic curing catalyst comprising a diaryl iodonium salt of hexafluoroantimonic acid, (B2) a second potential a cationic curing catalyst i.e. (B2a) diaryliodonium cation, (B2b) perchlorate, imide di sulfuryl fluoride anion, unsubstituted conversion and substituted (C 1 -C 12) - hydrocarbyl sulfonate, (C 2 -C 12) - perfluoro alkanoate, tetrafluoroborate, unsubstituted conversion and substituted tetra - (C 1 -C 12) - hydrocarbyl Bilbo rate, hexafluorophosphate, hexafluoroarsenate, tris (trifluoromethylsulfonyl) methyl anion, bis (trifluoromethyl Sulfonyl) methylanio , An anion selected from bis (trifluoromethylsulfuryl) imide anion and combinations thereof, and (B3) radical-generating aromatic compounds, peroxy compounds, copper (II) salts of aliphatic carboxylic acids, copper of aromatic carboxylic acids (II) an effective amount of a curing catalyst comprising a curing co-catalyst selected from salts, copper acetylacetonate (II) and combinations thereof; and (C) about 70-95 based on the total weight of the curable composition. A curing method useful for encapsulating semiconductor devices, comprising a weight percent inorganic filler. The curing catalyst in the composition of the present invention allows more filler to be used, thereby reducing moisture absorption and thermal expansion of the cured composition. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010101144-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5478603-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8574745-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2010101144-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010118649-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010147070-A1 |
| priorityDate | 2005-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 180.