| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L28-65 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-321
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate |
2005-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2008-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2008516465-A |
| titleOfInvention |
CMP composition with polymer additive for precious metal polishing |
| abstract |
The present invention provides a method for polishing a substrate, the method comprising contacting a substrate containing a noble metal on the surface of the substrate with a chemical mechanical polishing system (the system comprising (a) an abrasive, a polishing pad) A polishing component selected from the group consisting of: and (b) an oxidizing agent, (c) an ethylene oxide-containing polymer, and (d) a liquid carrier), and polishing the base Abrading at least a portion of the noble metal with a chemical mechanical polishing system. [Selection] No figure |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012511251-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011527643-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011119405-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010512030-A |
| priorityDate |
2004-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |