| abstract |
The present invention relates to a method of forming a protective coating on an electronic substrate such as an IC, the protective coating having good mechanical, chemical and physical resistance and providing suitable non-transparency. To do. According to the present invention, a porous matrix (preferably comprising TiO 2 ) is formed, which is filled with a filler component capable of absorbing or scattering light, such as TiN particles. After the curing step, a reinforcing precursor component is added. In preparing the protective coating, a predetermined amount of filler component is used to obtain at least 40% by volume filler component in the final protective coating based on the resulting porous matrix. The |