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filingDate 2005-05-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2008-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2008500714-A
titleOfInvention Electronic circuit board including flexible support and method for manufacturing the same
abstract The present invention relates to an electronic circuit substrate including a flexible support material that is sequentially covered with an electrically insulating layer and an amorphous layer or a polycrystalline silicon layer. The electrically insulating layer is a porous oxide layer. The present invention relates to an electronic circuit board including a flexible support material. The invention also relates to a method of manufacturing such a substrate.
priorityDate 2004-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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