http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008310009-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_17ae00da391aa3d8652ec3bd1dd0b3d3 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02B5-20 |
| filingDate | 2007-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1cfca17a52c444921136f5b68639b1be http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0f8cc32c4c36d42bed4e6c248eee0aa9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_44d435aff1027bd22820e520825969f5 |
| publicationDate | 2008-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2008310009-A |
| titleOfInvention | Photosensitive resin composition |
| abstract | Disclosed is a photosensitive resin composition that is less likely to cause coating unevenness, drying unevenness, dry deposits, and bump holes, and has excellent chromaticity uniformity within a substrate surface. A photosensitive resin composition comprising a maleimide copolymer resin, a photopolymerizable monomer, a pigment, a dispersant, a photopolymerization initiator, and a solvent, the solvent having a boiling point of atmospheric pressure of 100 ° C. or higher and 165 ° C. A photosensitive resin composition comprising a solvent A having a temperature lower than ℃ and a solvent B having a boiling point of atmospheric pressure of 165 ° C or higher and 200 ° C or lower. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009229880-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010150404-A |
| priorityDate | 2007-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 182.