| abstract |
Kind Code: A1 A photosensitive resin composition that has excellent adhesion to a substrate at the time of film formation and can form a fine resin pattern with a high film thickness and a high aspect ratio, and a pattern forming method using the same. provide. The photosensitive resin composition contains diphenyl sulfone or a derivative thereof as an adhesion enhancer. As the diphenylsulfone derivative, one in which one or more hydrogen atoms of diphenylsulfone are substituted with an amino group, a nitro group, a hydroxyl group, a carboxyl group, a fluorine atom, a chlorine atom, or an acid anhydride is preferable. Among them, the hydrogen atom of 3,3′-position and / or 4,4′-position of diphenylsulfone is substituted with amino group, nitro group, hydroxyl group, carboxyl group, fluorine atom, chlorine atom, or acid anhydride Is preferred. [Selection figure] None |