http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008308748-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9ec030fc062b270c25327af9127bed3a |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-285 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-16 |
| filingDate | 2007-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dca24ee8adfd38f86212d415d6d387a5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_017b30ecce9c523ab0b172143aa51914 |
| publicationDate | 2008-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2008308748-A |
| titleOfInvention | Method for forming copper film |
| abstract | The present invention provides a copper film forming method capable of forming a thin and uniform copper film on a substrate surface using copper formate which is stable and has good handleability. A substrate that is heated to a predetermined temperature is placed in an inert gas atmosphere that is inert at the heating temperature, and copper formate in a solvent that evaporates at the heating temperature toward the surface of the substrate. The copper formate solution in which the solution is dissolved is sprayed, the solvent in the copper formate solution sprayed at the heating temperature is evaporated, and the copper formate is thermally decomposed without using a catalyst to form a thin film on the predetermined surface of the substrate. A copper film is formed. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016050347-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013508934-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016141852-A |
| priorityDate | 2007-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 32.