| abstract |
A photosensitive resin composition excellent in improvement in sensitivity, resolution and resist stripping property, a photosensitive element using the same, a method for forming a resist pattern, and a method for producing a printed wiring board are provided. (A) A styrene-based methacrylic acid-based methacrylic ester-based terpolymer copolymer binder polymer, (B-1) one or both of vinyl acetate and vinyl propionate are contained as one of the components, (B-2) a photopolymerizable compound containing a bisphenol A-based (meth) acrylate bifunctional monomer and (C) a photosensitive resin composition containing a photopolymerization initiator, a photosensitive element using the same, A resist pattern forming method and a printed wiring board manufacturing method. [Selection] Figure 1 |