abstract |
An object of the present invention is to improve connection reliability of a connection terminal having a displacement gold plating film. SOLUTION: A conductor layer 2, an electroless nickel plating film 3, a first palladium plating film 4 which is a substituted or electroless palladium plating film having a purity of 99% by mass or more, and a purity of 90% by mass or more and 99% by mass. 2nd palladium plating film 5 which is less than% electroless palladium plating film, and displacement gold plating film 6, electroless nickel plating film 3, first palladium plating film 4, and second palladium plating The coating 5 and the displacement gold plating film 6 are laminated in this order on one side of the conductor layer 2, and the displacement gold plating film 6 is located on the outermost layer on the side opposite to the conductor layer 2. . [Selection] Figure 1 |