http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008285544-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_691352a86d10e05805852aee7ad9258c |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07D303-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 |
| filingDate | 2007-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_238a83e587656eddce4110ddffe4a373 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1d3c0f75253ac306b777125f0203d17a |
| publicationDate | 2008-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2008285544-A |
| titleOfInvention | Epoxy compound containing fluorene ring and method for producing the same |
| abstract | An object of the present invention is to provide an epoxy compound (epoxy resin) having low hygroscopicity and high heat resistance and a method for producing the same. An epoxy compound containing a fluorene ring, which is represented by the following general formula (1): A 9,9-bis (dihydroxyphenyl) fluorene compound obtained by reacting fluorenone and dihydric phenol is glycidyl etherified to produce a compound of the general formula (1). The divalent phenol is resorcinol or catechol. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014237602-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017036249-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015117358-A |
| priorityDate | 2007-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 45.