| abstract |
In a semiconductor integrated circuit using copper as a wiring metal, a technique for realizing a highly flat surface is provided. A neutralized carboxylic acid, an oxidizing agent, and water are contained, a part of the carboxylic acid is an alicyclic resin acid (A), and a pH value is 7.5 to 12. Polishing composition in the range of. The alicyclic resin acid is preferably at least one selected from the group consisting of abietic acid, an isomer of abietic acid, pimaric acid, an isomer of pimaric acid, and derivatives thereof, or rosin. [Selection figure] None |