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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-088
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filingDate 2008-08-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6035b0325fde67cdf041ff9c4e5059ac
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publicationDate 2008-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2008279781-A
titleOfInvention Polyimide metal laminate
abstract Since a metal wiring can recognize an image through a polyimide layer after circuit processing, the circuit can be positioned by an inner lead bonder which is not a flip chip type, and a polyimide metal having an excellent light transmittance of an insulating layer Provide a laminate. A metal bonded to a thermoplastic polyimide in a polyimide metal laminate in which a thermoplastic polyimide layer is formed on one surface of one or more non-thermoplastic polyimide layers, and a metal is laminated on the surface of the thermoplastic polyimide layer. Surface area ratio of the metal surface to be joined to the thermoplastic polyimide (value obtained by dividing the actual surface area by the area assuming that the measurement surface is smooth) is 1 A metal laminate having a thickness of 0018 or less. [Selection figure] None
priorityDate 2008-08-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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