http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008279781-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7ef01e33058cf740cf2197991be97af1 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-088 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 |
filingDate | 2008-08-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6035b0325fde67cdf041ff9c4e5059ac http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0c35fcd5e6ac302b5e21b5da78ccafc6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_caf7138642beceaab6b5cd74c358544f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2fdf5234de3de8b3aabc4497d2510c23 |
publicationDate | 2008-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2008279781-A |
titleOfInvention | Polyimide metal laminate |
abstract | Since a metal wiring can recognize an image through a polyimide layer after circuit processing, the circuit can be positioned by an inner lead bonder which is not a flip chip type, and a polyimide metal having an excellent light transmittance of an insulating layer Provide a laminate. A metal bonded to a thermoplastic polyimide in a polyimide metal laminate in which a thermoplastic polyimide layer is formed on one surface of one or more non-thermoplastic polyimide layers, and a metal is laminated on the surface of the thermoplastic polyimide layer. Surface area ratio of the metal surface to be joined to the thermoplastic polyimide (value obtained by dividing the actual surface area by the area assuming that the measurement surface is smooth) is 1 A metal laminate having a thickness of 0018 or less. [Selection figure] None |
priorityDate | 2008-08-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 47.