| abstract |
(A) Thermosetting resin having a compound having a dihydrobenzoxazine ring as a main component, 35 to 75 per 100 parts by weight of the total organic solid content of the following components (A), (B) and (C). Parts by weight; (B) 10-25 parts by weight of a polycondensate of phenols, a compound having a triazine ring and aldehydes; and (C) 10-40 parts by weight of an epoxy resin, and in the component (C), In an amount of 0 to 100% by weight of component (C), (i) a bisphenol F type epoxy resin having a weight average molecular weight of 1,000 to 3,000, or (ii) a weight average molecular weight of 1,000 to 3,000. A thermosetting resin composition comprising a mixed epoxy resin of a certain bisphenol F type epoxy resin and a bisphenol A type epoxy resin is provided. [Effect] A prepreg, a laminated board for a wiring board and a wiring board can be obtained. [Selection figure] None |