http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008274002-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-18
filingDate 2007-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d12be8df04a325567898d06180a84d51
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_97bdea672a7c8698f6aa63874e28ba46
publicationDate 2008-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2008274002-A
titleOfInvention Resin composition and prepreg, metal-clad laminate, resin-coated metal foil, adhesive film, and printed wiring board using the resin composition
abstract PROBLEM TO BE SOLVED: To provide flexibility to an insulating layer by using a resin composition comprising a filler having a high dielectric constant, hardly causes defects such as cracking, chipping and bending even by itself, and has a thickness of several to several tens of μm. Provided are a prepreg having an insulating layer having a dielectric constant, a metal-clad laminate, a resin-coated metal foil, an adhesive film, and a printed wiring board. A resin composition containing a silicone resin and a high dielectric constant filler, a prepreg obtained using the resin composition, a metal-clad laminate obtained using the prepreg, and obtained using the resin composition. A printed wiring board obtained by using at least one of a metal foil with resin, an adhesive film, the above resin composition prepreg, a metal-clad laminate, a metal foil with resin, and an adhesive film. [Selection figure] None
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170004903-A
priorityDate 2007-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0912742-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11116820-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H1135704-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003049092-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11116807-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002265797-A
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID457707770
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID21887592
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID453284447
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID450068310
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID451192803
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID165950
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID449422376
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID449318997
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID3084098
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID421757602
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID159419
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID453357195
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID16211560
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID447871845
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID21225548
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID16212381
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID82899
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID447635095
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID456367111
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID26042
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID16212531

Total number of triples: 43.