http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008270385-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_be055db3c1a09879df07379ba969e223 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40 |
| filingDate | 2007-04-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_06ba8983bed8a96a266c2a7980163d55 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2a7d22ec4f8dda5378092e3ebfda609e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8aa6863350e89cdb57b50755a6bbb7b8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5859d0d1108849c326158f7dab89c3af http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4276cf31a9d2e27afcc95865f73ba7bd |
| publicationDate | 2008-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2008270385-A |
| titleOfInvention | Printed wiring board, manufacturing method thereof, and via paste for printed wiring board used therefor |
| abstract | In the case of a printed wiring board using a conventional printed wiring board via paste for via connection (or interlayer connection), the printed wiring board via paste and the resin material constituting the insulating layer are different. In the via paste portion, the peel strength may be lower than the portion other than the via portion (for example, an insulating layer portion made of glass cloth or the like). After filling a via hole 13 formed in a prepreg 19 with a printed wiring board via paste 13 composed of a conductor powder 15 and a liquid component 23, a part or more of the liquid component 23 is removed by suction or washing. The gap 24 is formed by removing by centrifugal force removal or the like, and the gap 24 is impregnated with the resin portion 17 constituting the prepreg 19 to increase the high peel strength of the via portion. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5652481-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2012108381-A1 |
| priorityDate | 2007-04-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 22.