| abstract |
In a positive photosensitive composition used in semiconductor manufacturing processes such as IC, circuit boards such as liquid crystals and thermal heads, and other photofabrication processes, and a pattern forming method using the same. Provided is a positive photosensitive composition having improved pattern collapse even in the formation of a fine pattern of 100 nm or less, and a pattern forming method using the same. (A) a compound that generates an acid upon irradiation with actinic rays or radiation, and (B) a specific repeating unit (B1) having a tertiary ester group substituted with an alkoxycarbonyl group. A positive photosensitive composition containing a resin that decomposes by action and increases the solubility in an alkaline developer, and a pattern forming method using the same. [Selection figure] None |